Infrared Thermal Imaging
Infrared Thermal Imaging
  • Details
  • Function
  • Parameter

 The infrared thermal imager integrates imported infrared imaging cameras (focal plane array (FPA), non-cooled micro thermal radiation sensor architecture, wafer-level vacuum packaging technology) and visible light digital cameras inside. It features a small size, low power consumption, precise detection, wide coverage range, and is well-suited for harsh environments near motors with complex conditions. Its IP6-7 grade enclosure packaging form makes it particularly suitable.



 The infrared imaging camera inside the probe operates based on the principle that "the higher the temperature of an object, the shorter the infrared wavelength it emits". It collects the infrared wavelengths emitted by the objects within the illuminated area, calculates the surface temperature of the objects in reverse, and quantifies it as a digital value, then draws a real-time heat map.

    The visible light digital camera captures real-time images of objects, extracts the characteristic contours of the objects, integrates them with the thermal images, and combines them with multi-band dynamic imaging algorithms. This enables it to provide richer image details than traditional thermal imaging cameras.





Description

Parameters

Collection wavelength

7.3 - 13um

Array collection size

80*60 hotspots

Maximum frame rate

25fps

Lens

55DFOV

Object temperature range

-40 to +150

Temperature measurement accuracy

+/- 2 degrees or 2%

Size

95*54*25mm

Interface

Ethernet IP, ModBus TCP

Power supply voltage

DC 10-30V

Video streaming format

H264MJPEGMPEG


Address:Room 706, Huaxin Building, Yangzhuang Road, Shijngshan District, Beijing
Postcode:100043
TEL:13801042802
Email:stgkdq@vip.163.com
Copyright © 2018-2025 北京斯拓高科电气有限公司 All Rights Reserved.